|
Model name
|
S10
|
S20
|
|
Board
Size
|
With buffer unused
|
Min. L50 x W30mm to
Max. L980 x W510mm
|
Min. L50 x W30mm to
Max. L1,480 x W510mm
|
|
With input or output buffers used
|
Min. L50 x W30mm to
Max. L420 x W510mm
|
—
|
|
With input and output buffers used
|
Min. L50 x W30mm to
Max. L330 x W510mm
|
Min. L50 x W30mm to
Max. L540 x W510mm
|
|
With input and output buffers used
|
0.4 - 5.0mm
|
|
Placement accuracy A (μ+3σ)
|
CHIP ± 0.040mm
|
|
Placement accuracy B (μ+3σ)
|
IC ± 0.025mm
|
|
Placement angle
|
± 180°
|
|
Component height
(Board thickness + component height)
|
6-axis 6-theta head: Max. 35mm
12-axis 2-theta head: Max. 20mm
|
|
Applicable Components
|
0201-120mm x 90mm, BGA, CSP,Connectors,
other odd-shaped components
|
|
Component package
|
8-56mm tape (F1/F2 Feeders),
8-88mm tape (F3 Electric Feeders),
Stick, Tray
|
|
Component types
(8mm tape conversion)
|
Max. 90 types
(8mm tape), 45 lanes x 2
|
Max. 180 types
(8mm tape), 45 lanes x 4
|
|
Transfer height
|
900 ± 20mm
|
|
Machine Dimensions
|
L1,250 x D1,770 x
H1,420mm
|
L1,750 x D1,770 x
H1,420mm
|
|
Weight
|
Approx. 1,200kg
|
Approx. 1,500kg
|
